Debug Header Target Footprints

To connect a debug header directly to a target board (without the use of a transition socket), the following information will be helpful.

Dual Inline Packages (DIP) Device Footprints

The DIP device adapter footprints shown will accept adapter plugs like the Samtec series APA plugs. These plugs can be soldered into place during development/emulation and eliminate the need for any other sockets.

HeaderX_4_2_1.jpg
Figure: DIP Footprint

Thin Quad Flat Pack (TQFP)/Plastic Leaded Chip Carrier (PLCC) Device Footprints

The TQFP/PLCC device adapter footprints shown will accept board stackers like the Samtec series DWM 0.050 Pitch Stackers. These stackers can be soldered into place during development/emulation and eliminate the need for any other sockets.

HeaderX_4_3_1.jpg
Figure: Single-Row TQFP/PLCC Footprint


HeaderX_4_3_2.jpg
Figure: Double and Triple-Row TQFP/PLCC Footprint

Header pin-out matches the PLCC package. PLCC will map to TQFP as follows:

  • Header to 44-pin TQFP – one-to-one mapping.
  • Header to 64-pin TQFP – see "Figure: Header to 64-Pin TQFP" for mapping.
  • Header to 80-pin TQFP – see "Figure Header to 80-Pin TQFP" for mapping.
  • Header to 100-pin TQFP – one-to-one mapping.
HeaderX_4_3_3.jpg
Figure: Header to 64-Pin TQFP


HeaderX_4_3_4.jpg
Figure: Header to 80-Pin TQFP

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